장비 sale(DIEBONDER)
글쓴이 :        날짜 : 2018-07-17 13:12:18         조회 : 130


 

* DBD-7000(TOSOK - JAPAN). DIEBONDER

  1. PKG : LED , Power TR , Module , MCP

  2. Specification

      ^ Process : Thermocompression and/epoxy proces

      ^ Cycle time : 0.35 sec/die

      ^ Lead frame size : 30-90mm(W) , 70-260mm(L)

      ^ Die size : 0.8x0.8-2.5x2.5 mm  , 2.5x2.5-25.0x25.0 mm

      ^ Wafer size : 8'(Standard)  , 12' (option)

      ^ Dimension : 1,600(W)x1,400(D)x1,800(H) mm

      ^ Weight : 2,000 kg

      ^ 2008 years.

 
목록